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2020 The 6th International Conference on Mechanical and Electronics Engineering

Osaka International Convention Center, Japan
May 10-12, 2020

Paper Submission is now open for ICMEE! Check out the Call for Papers.
The 6th ICMEE 2020 is going to be held in Osaka International Convention Center.
Accepted and Presented papers can be included in ICMEE conference proceedings, which can be indexed byEI Compendex and SCOPUS.

Welcome to the 6th ICMEE 2020

2020 6th International Conference on Mechanical and Electronics Engineering is to be held in Osaka Convention Center, Osaka, Japan during May 10-12, 2020. It is the premier forum for the presentation of new advances and research results in the fields of theoretical, experimental, and applied Mechanical and Electronics Engineering. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world.

Sincerely welcome your join with following three types.

  • As Author: submit Full-length Manuscript for review before the submission deadline. After acception, the paper can be published and you will be invited to deliver presentation on ICMEE 2020, orally or poster presentation.Doc Template LaTex
  • As Presenter: deliver a presentation on ICMEE 2020, but the manuscript WILL NOT be published. Abstract is necessary to submit. Abstract Template
  • As Listener: participate and attend all presentation sessions only, neither making presentation nor having paper published. Please downlaod the form, fill it and feed back to secretary icmee@outlook.comRegistration From

Conference Proceedings

All accepted and presented papers will be published by ICMEE proceedings and made available through IEEE Xplore.

Proceedings will be submitted for inclusion in leading indexing services, including Ei Compendex, Scopus, etc

The 1st ICMEE-Kyoto, Japan | IEEE Xplore ISBN: 978-1-4244-7480-6 | Online
The 2nd ICMEE-Hefei, China | AMM ISBN: 978-3-03785-286-6 | Online
.........
The 5th ICMEE-Dalian, China | Matec ISSM: 2261-236X Vol.31 | Online

Topics

The works that will be presented at conference will focus on, but are not limited to, the following topics:

  • Mechanical Engineering
  • Acoustics and Noise Control Marine System Design
  • Aerodynamics Material Engineering
  • Applied Mechanics Material Science and Processing
  • IoT and e-health
  • Automation, Mechatronics and Robotics Mechanical Design
  • Automobiles Mechanical Power Engineering
  • Automotive Engineering Mechatronics
  • Network security, trust and privacy in a wired/wireless environmenBallistics MEMS and Nano Technology
  • Biomechanics Multibody Dynamics
  • Biomedical Engineering Nanomaterial Engineering
  • CAD/CAM/CIM New and Renewable Energy
  • CFD Noise and Vibration
  • Composite and Smart Materials Noise Control
  • Compressible Flows Non-destructive Evaluation
  • Computational Mechanics Nonlinear Dynamics
  • Computational Techniques Oil and Gas Exploration
  • please get more information here

Speakers

to be announced soon

Important News+1

August 30, 2019

2020 6th International Conference on Mechanical and Electronics Engineering is to be held in Osaka Convention Center, Osaka, Japan during May 10-12, 2020. Call for papers now!!

Important dates

Paper Submission Deadline: December 10, 2019
Paper Decision Notification: December 25, 2019

Abstract Submission Deadline: December 10, 2019
Abstract Decision Notification: Five working days

Special Sessions ot Workshops Proposal: March 10, 2020
Decision Notification: March 30, 2020

Registration Opens: January 10, 2020

About Osaka

OFFICIAL SPONSORS AND PARTNERS