2020 6th International Conference on Mechanical and Electronics Engineering is to be held in Osaka Convention Center, Osaka, Japan during May 10-12, 2020. It is the premier forum for the presentation of new advances and research results in the fields of theoretical, experimental, and applied Mechanical and Electronics Engineering. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world.
Sincerely welcome your join with following three types.
All accepted and presented papers will be published by ICMEE proceedings and made available through IEEE Xplore.
Proceedings will be submitted for inclusion in leading indexing services, including Ei Compendex, Scopus, etc
The 1st ICMEE-Kyoto, Japan | IEEE Xplore ISBN: 978-1-4244-7480-6 | Online
The 2nd ICMEE-Hefei, China | AMM ISBN: 978-3-03785-286-6 | Online
The 5th ICMEE-Dalian, China | Matec ISSM: 2261-236X Vol.31 | Online
The works that will be presented at conference will focus on, but are not limited to, the following topics:
to be announced soon
August 30, 2019
2020 6th International Conference on Mechanical and Electronics Engineering is to be held in Osaka Convention Center, Osaka, Japan during May 10-12, 2020. Call for papers now!!
Final Paper Submission Deadline: Mar. 05, 2020
Paper Decision Notification: Mar. 25, 2020
Final Abstract Submission Deadline: Mar. 05, 2020
Abstract Decision Notification: Five working days
Special Sessions ot Workshops
Mar. 10, 2020
Decision Notification: Mar. 30, 2020
Registration Opens: Apr. 10, 2020