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2021 The 6th International Conference on Mechanical and Electronics Engineering

Osaka International Convention Center, Japan
May 10-12, 2021

Paper Submission is now open for ICMEE! Check out the Call for Papers.
The 6th ICMEE 2021 is going to be held in Osaka International Convention Center.
Accepted and Presented papers can be included in ICMEE conference proceedings, which can be indexed byEI Compendex and SCOPUS.

Welcome to the 6th ICMEE 2021

2021 6th International Conference on Mechanical and Electronics Engineering is to be held in Osaka Convention Center, Osaka, Japan during May 10-12, 2021. It is the premier forum for the presentation of new advances and research results in the fields of theoretical, experimental, and applied Mechanical and Electronics Engineering. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world.

Sincerely welcome your join with following three types.

  • As Author: submit Full-length Manuscript for review before the submission deadline. After acception, the paper can be published and you will be invited to deliver presentation on ICMEE 2021, orally or poster presentation.Doc Template
  • As Presenter: deliver a presentation on ICMEE 2021, but the manuscript WILL NOT be published. Abstract is necessary to submit. Abstract Template
  • As Listener: participate and attend all presentation sessions only, neither making presentation nor having paper published. Please downlaod the form, fill it and feed back to secretary icmee@outlook.comRegistration From

Announcement

Some participants are now facing travel restrictions and may have to cancel their schedule because of COVID-19. According to this situation, the conference is available to use all social media methods, such as online/video presentation, etc, except the regular presentation types (oral & poster). For online, papers can be published on time and enjoy special registration.

Conference Proceedings

All accepted and presented papers will be published by ICMEE IOP proceedings, Materials Science and Engineering, and indexed by Scopus, etc

The 1st ICMEE-Kyoto, Japan | IEEE Xplore ISBN: 978-1-4244-7480-6 | Online
The 2nd ICMEE-Hefei, China | AMM ISBN: 978-3-03785-286-6 | Online
.........
The 5th ICMEE-Dalian, China | Matec ISSM: 2261-236X Vol.31 | Online

Topics

The works that will be presented at conference will focus on, but are not limited to, the following topics:

  • Mechanical Engineering
  • Acoustics and Noise Control Marine System Design
  • Aerodynamics Material Engineering
  • Applied Mechanics Material Science and Processing
  • IoT and e-health
  • Automation, Mechatronics and Robotics Mechanical Design
  • Automobiles Mechanical Power Engineering
  • Automotive Engineering Mechatronics
  • Network security, trust and privacy in a wired/wireless environmenBallistics MEMS and Nano Technology
  • Biomechanics Multibody Dynamics
  • Biomedical Engineering Nanomaterial Engineering
  • CAD/CAM/CIM New and Renewable Energy
  • CFD Noise and Vibration
  • Composite and Smart Materials Noise Control
  • Compressible Flows Non-destructive Evaluation
  • Computational Mechanics Nonlinear Dynamics
  • Computational Techniques Oil and Gas Exploration
  • please get more information here

Important News+1

February 28, 2020

Welcome Prof. Zheng Liu from Nanyang Technological University, Singapore join and delivery a keynote speech.

December 31, 2020

The ICMEE organizing committee may you have a beautiful and healthy life in 2020. Happy new year

August 30, 2019

2020 6th International Conference on Mechanical and Electronics Engineering is to be held in Osaka Convention Center, Osaka, Japan during May 10-12, 2020. Call for papers now!!

Important dates

Paper Submission Deadline: Jan. 05, 2021
Paper Decision Notification: Jan. 25, 2021

Abstract Submission Deadline: Jan. 05, 2021
Abstract Decision Notification: Five working days

Special Sessions or Workshops Proposal:
Mar. 10, 2021

Decision Notification: Mar. 30, 2021

Registration Opens: Feb. 10, 2021

About Osaka

OFFICIAL SPONSORS AND PARTNERS